4-layer impedance gold finger circuit board

Application Industry：

Internet of Things

Application Product：

Server

Layers：

4

Special Process：

Impedance

Surface Treatment：

ENIG (Electroless Nickel Immersion Gold) Gold Finger Electroplating

Material：

FR4

Outer Layer Line Width/Space：

5/3.5 mil

Inner Layer Line Width/Space：

20/6 mil

Board Thickness：

1.6 mm

Minimum Hole Diameter：

0.25 mm